FAQ 1 of the hottest PCB ink

2022-10-12
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PCB ink FAQ (I)

item

problem

name

phenomenon

possible causes

countermeasures

1

uneven ink

board ink cannot be uniformly attached to dot like strip or sheet ink white spots (unable to ink)

insufficient ink mixing time

ink mixing error

board oil or water stains residue (dirty pretreatment)

ink impurities (the surface tension is destroyed by the mixing of oil stains in the tape)

the material of the scraper is poor

the cleaning of the version is dirty

the ink is expired after mixing

check the pretreatment line to confirm the operation quality of the drying section

check whether each section of the pretreatment meets the process standards (water break, abrasion marks)

confirm the ink mixing parameters

clean the version, replace the scraper and other tools

2

large copper surface cavitation

1 The speed of the ink and copper surface separator in the full coverage area of the ink on the big copper surface is slow

poor pretreatment

adhesion of impurities on the board

copper surface depression

poor ink mixing

uneven ink thickness on the copper surface

the ink surface is impacted and damaged by monomer purity ≥ 99.9%

uneven temperature distribution in the oven and insufficient or excessive baking

tin spraying for many times or tin spraying temperature is too high

check the pretreatment line,the, Confirm whether each working section can meet the quality requirements

confirm the baking temperature and oven distribution temperature rise curve

confirm the ink mixing parameters

check the production process to reduce external force impact

confirm the tin spraying operation parameters and conditions

2 Large copper surface or circuit surface corner ink full coverage area ink and copper surface separation

ink printing is too thin

pretreatment is poor at the circuit corner

insufficient baking

tin spraying for many times or tin spraying temperature is too high

soaking flux for too long

flux attack is too strong

ink damage at the corner

adjust the thickness of solder proof printing

reduce the thickness of circuit plating

confirm the baking conditions and oven distribution temperature rise curve

confirm the parameters and conditions of tin spraying operation

check the production process to reduce external force impact

check the pre-treatment line to confirm the quality requirements of the drying section

3

plug hole explosion

1. Ink overflow after exposure

1 Exposure negative film has poor air evacuation action

2. Exposure vacuum pumping is poor

3. The positioning piece is not inserted into the hole

4. The vacuum suction pressure is unstable

5. Sundries are attached to the negative film

1. The negative film needs to be attached to the operation board during exposure

2. Use a gas guide strip thinner than the operation board

3. The positioning pin needs to be inserted into the positioning hole

4. Check the negative film and self-examination

items.

problem name

phenomenon

may be the original Because

countermeasures

2. Ink overflow after post baking

1. No sectional temperature rise

2. The temperature of the low-temperature section of the sectional temperature rise is too high

3. The time of the low-temperature section of the sectional temperature rise is insufficient

4. The sectional temperature rise is not continuous baking

5. The temperature distribution of the oven is uneven or the direction is not fixed

1. The post baking oven must be sectional temperature rise

2. The sectional temperature rise requires continuous baking

3. confirm that the air compressor in the oven Temperature rise curve of each area

4. The direction of hot air must be the same direction

5. Confirm the operation parameters

3. Ink overflow after tin spraying

the temperature in the high-temperature section of sectional heating is too low

the time in the high-temperature section of sectional heating is insufficient

the temperature distribution of the oven is uneven or the direction is not fixed

poor exhaust of the oven

the operation board is not pre baked and heated before tin spraying

multiple tin spraying

bad piece design

confirm oven Temperature rise curve in each area

confirm baking operation parameters

confirm tin spraying operation parameters and conditions

pre bake and heat the operation board before tin spraying

4

plug hole cavitation

4. Hole edge cavitation after tin spraying

operation board before tin spraying is not pre baked and heated

multiple tin spraying

tin temperature is too high

insufficient baking after tin spraying

pretreatment poor (water and oil residue in the hole)

insufficient roughness in the hole (insufficient etching rate)

insufficient surface roughness (poor brushing and grinding, insufficient etching rate)

the plug hole is too full

the time of sectional heating up at low temperature is insufficient

the ink swelling coefficient is too large, and the ink adhesion is poor

1. The operation board is pre baked and heated before tin spraying

2. Confirm the tin spraying operation parameters and conditions

3. Confirm the post baking operation parameters

4. Check the front processing line to confirm whether it meets the process standard quality

5. Do not use the same kind of ink for three operations (plug hole, printing, printing) Space needs to be reserved in the hole, but there is uncertainty in the project land

6. Modify the ink property

7. Modify the design to crab feet

5

broken grid line

broken anti welding isolation line between pads

1. The ink printing is too thick

2. Insufficient exposure energy

3. The development temperature is too high

4. The development pressure is too high

5. The development time is too long <

6. The light transmittance of the negative is too low

7. The residence time is insufficient

8 The exposure lamp is expired

9. The exposure cooling quartz tube is too dirty

10. The ink is poor and the sensitivity is insufficient

11. The pre baking is insufficient

1. Confirm the exposure operation parameters

2. Confirm the development operation parameters

3. Reduce the ink printing thickness

4. Increase the dead time after exposure

5. Use the operation negative film with better light transmittance

6. Confirm the service life of the exposure lamp

7.. modify the ink property

item

problem Name

phenomenon

possible causes

countermeasures

6

unclean development

the ink in the area to be developed (black or brown area of the negative film during Anti welding exposure) cannot be completely removed

over pre baking

poor exhaust loop of the oven

expired ink or wrong ink mixing

too long stagnation time after pre baking

poor environment (moisture too heavy, too high temperature)

the light in the operation area is not UV proof lamp tube

the exposure energy is too high

the development temperature is too low

9. The development pressure is too small

10. The developer concentration is insufficient

11. The development time is too short

12. The shading rate of the negative film is too low

13. The water content of the diluent is too high

14. The light transmission of the plate is too low

1. Confirm whether the ink brand is consistent before mixing.And ink quality

2. Confirm baking conditions and oven distribution temperature rise curve

3. Confirm the surrounding operation environment and equipment

4. Confirm the exposure operation parameters

5. Confirm

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